The 430BOOST-TMP006 is a BoosterPack provides a quick and low cost solution to evaluate and develop with TMP006 is a contactless temperature sensor that uses an infrared thermopile sensor to detect the temperature of a target object. The TMP006EVM circuit board to be used with the MSP430 LaunchPad. The evaluation module is designed to allow full evaluation of the TMP006 device. The evaluation module features the TMP006 device with the required specific PCB layout and some simple support circuitry. The GUI for the evaluation module implements the full object temperature calculations allowing the user to measure object temperatures with the TMP006 BoosterPack.
TI TMP006 BoosterPack is an adapter board that allows TMP006EVM board to use with MSP430 LaunchPad
TMP006 BoosterPack capable of connecting to 2x TMP006EVM circuit boards
A GUI is available for implementing full object temperature calculations
TMP006 is a contactless temperature sensor that uses an infrared thermopile sensor
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