HARWIN
芯片和元件插座, D28系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
芯片插座, DIP, 触点数:40, 排距:0.3'', 1A
MILL MAX
芯片插座, DIP, 40路, 通孔安装
AMP - TE CONNECTIVITY
芯片插座, DIP, 触点数:40, 排距:0.6''
芯片和元件插座, 2227系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
KESTER SOLDER
焊丝, 63/37 锡/铅, 183 度, 1磅
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