IS43DR16640B-25DBLI,2253820,芯片, 存储器, SDRAM, DDR2, 1GB, 1.8V, 84BGA,INTEGRATED SILICON SOLUTION (ISSI)
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IS43DR16640B-25DBLI - 

芯片, 存储器, SDRAM, DDR2, 1GB, 1.8V, 84BGA

INTEGRATED SILICON SOLUTION (ISSI) IS43DR16640B-25DBLI
声明:图片仅供参考,请以实物为准!
制造商产品编号:
IS43DR16640B-25DBLI
仓库库存编号:
2253820
技术数据表:
(EN)
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IS43DR16640B-25DBLI产品概述

The IS43DR16640B-25DBLI is a 1Gb DDR2 SDRAM with 400MHz frequency, DDR2-800D speed grade and 64Mb x 16 organization. For application flexibility, burst length, burst type, CAS# latency, DLL reset function, write recovery time (WR) are user defined variables and must be programmed with a Mode Register Set (MRS) command. Additionally, DLL disable function, driver impedance, additive CAS latency, ODT (On Die Termination), single-ended strobe and OCD (off chip driver impedance adjustment) are also user defined variables and must be programmed with an Extended Mode Register Set (EMRS) command. Contents of the Mode Register (MR) or Extended Mode Registers EMR[1] and EMR[2] can be altered by re-executing the MRS or EMRS Commands. Even if the user chooses to modify only a subset of the MR, EMR[1] or EMR[2] variables, all variables within the addressed register must be redefined when the MRS or EMRS commands are issued.
  • 8 Internal banks for concurrent operation
  • 4-bit Prefetch architecture
  • Programmable CAS latency - 3, 4, 5, 6 and 7
  • Programmable additive latency - 0, 1, 2, 3, 4, 5 and 6
  • Write latency = Read Latency-1
  • Sequential or interleave programmable burst sequence
  • 4 and 8 programmable burst length
  • Automatic and controlled precharge command
  • Power down mode
  • Auto refresh and self refresh
  • 7.8μs (8192 cycles/64ms) Refresh interval
  • ODT (On-Die Termination)
  • Weak strength data-output driver option
  • Bidirectional differential data strobe (single-ended data-strobe is an optional feature)
  • On-chip DLL aligns DQ and DQs transitions with CK transitions
  • DQS# can be disabled for single-ended data strobe
  • Read data strobe supported (x8 only)
  • Differential clock inputs CK and CK#
  • VDD and VDDQ = 1.8V ±0.1V
  • PASR (Partial Array Self Refresh)

工业, 商业, 车用

IS43DR16640B-25DBLI产品信息

  DRAM 内存配置  64M x 16位  
  存取时间  -  
  页面尺寸  -  
  针脚数  84引脚  
  封装类型  BGA  
  工作温度最小值  -40°C  
  工作温度最高值  85°C  
  芯片接口类型  SSTL  
  封装  每个  
  产品范围  -  
  MSL  MSL 3 - 168小时  
关键词         

IS43DR16640B-25DBLI相关搜索

DRAM 内存配置 64M x 16位  INTEGRATED SILICON SOLUTION (ISSI) DRAM 内存配置 64M x 16位  DRAM DRAM 内存配置 64M x 16位  INTEGRATED SILICON SOLUTION (ISSI) DRAM DRAM 内存配置 64M x 16位   存取时间 -  INTEGRATED SILICON SOLUTION (ISSI) 存取时间 -  DRAM 存取时间 -  INTEGRATED SILICON SOLUTION (ISSI) DRAM 存取时间 -   页面尺寸 -  INTEGRATED SILICON SOLUTION (ISSI) 页面尺寸 -  DRAM 页面尺寸 -  INTEGRATED SILICON SOLUTION (ISSI) DRAM 页面尺寸 -   针脚数 84引脚  INTEGRATED SILICON SOLUTION (ISSI) 针脚数 84引脚  DRAM 针脚数 84引脚  INTEGRATED SILICON SOLUTION (ISSI) DRAM 针脚数 84引脚   封装类型 BGA  INTEGRATED SILICON SOLUTION (ISSI) 封装类型 BGA  DRAM 封装类型 BGA  INTEGRATED SILICON SOLUTION (ISSI) DRAM 封装类型 BGA   工作温度最小值 -40°C  INTEGRATED SILICON SOLUTION (ISSI) 工作温度最小值 -40°C  DRAM 工作温度最小值 -40°C  INTEGRATED SILICON SOLUTION (ISSI) DRAM 工作温度最小值 -40°C   工作温度最高值 85°C  INTEGRATED SILICON SOLUTION (ISSI) 工作温度最高值 85°C  DRAM 工作温度最高值 85°C  INTEGRATED SILICON SOLUTION (ISSI) DRAM 工作温度最高值 85°C   芯片接口类型 SSTL  INTEGRATED SILICON SOLUTION (ISSI) 芯片接口类型 SSTL  DRAM 芯片接口类型 SSTL  INTEGRATED SILICON SOLUTION (ISSI) DRAM 芯片接口类型 SSTL   封装 每个  INTEGRATED SILICON SOLUTION (ISSI) 封装 每个  DRAM 封装 每个  INTEGRATED SILICON SOLUTION (ISSI) DRAM 封装 每个   产品范围 -  INTEGRATED SILICON SOLUTION (ISSI) 产品范围 -  DRAM 产品范围 -  INTEGRATED SILICON SOLUTION (ISSI) DRAM 产品范围 -   MSL MSL 3 - 168小时  INTEGRATED SILICON SOLUTION (ISSI) MSL MSL 3 - 168小时  DRAM MSL MSL 3 - 168小时  INTEGRATED SILICON SOLUTION (ISSI) DRAM MSL MSL 3 - 168小时  
电话:400-900-3095
QQ:800152669

IS43DR16640B-25DBLI产地与重量

原产地:
Taiwan

进行最后一道重要生产流程所在的国家

RoHS 合规:
税则号:
85423231
重量(千克):
.005
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