品牌：LAIRD TECHNOLOGIES,
LAIRD TECHNOLOGIES
开发套件, 蓝牙, 音频, 内置天线
LAIRD TECHNOLOGIES
Development Board, Bluetooth, IOT, smartBASIC Intelligent, RM186-SM
LAIRD TECHNOLOGIES
Development Board, Bluetooth, IOT, RM191-SM
LAIRD TECHNOLOGIES
开发套件, 蓝牙2.0, 1级, 内部天线
LAIRD TECHNOLOGIES
开发套件, 蓝牙2.0, 1级, 外部天线
LAIRD TECHNOLOGIES
开发套件, BTV2.1增强1级内部天线
LAIRD TECHNOLOGIES
开发套件, BTV2.1增强1级外部天线
LAIRD TECHNOLOGIES
Evaluation Board, RM024 2.4 GHz Radio Module, 500 Kb/s Output Speeds, Mini SMT Package
LAIRD TECHNOLOGIES
开发套件, RM024, 射频无线, RAMP 2.4GHZ
LAIRD TECHNOLOGIES
弹簧装配夹 TO-220
(EN)
LAIRD TECHNOLOGIES
热绝缘, Thermaflex管, TO-220, 硅树脂喷出, 0.7 W/m.K, 8000 V, 0.5 mm
(EN)
LAIRD TECHNOLOGIES
弹簧装配夹 2 X TO-220
(EN)
LAIRD TECHNOLOGIES
弹簧装配夹 TO-3P
(EN)
LAIRD TECHNOLOGIES
热绝缘, Thermaflex管, TO-3P, 硅树脂喷出, 0.7 W/m.K, 8000 V, 0.5 mm
(EN)
LAIRD TECHNOLOGIES
热缝隙填充, 229 X 229MM, 0.5MM
(EN)
LAIRD TECHNOLOGIES
热绝缘, 散热垫, TGARD 500-A0 12" x 18", 碳, 6 kV, 2.9 °C/W
(EN)
LAIRD TECHNOLOGIES
热绝缘, 导热界面, 11.75" x 18", 玻璃纤维 / 硅橡胶, 6 kV, 0.23 mm, 1000000 Mohm-m, 1.17 °C/W
(EN)
LAIRD TECHNOLOGIES
弹簧夹, T-gon™, 7mm
LAIRD TECHNOLOGIES
热绝缘, 导热界面, 12" x 18", 6 kV, 0.13 mm, 1000000 Mohm-m, 1.36 °C/W
(EN)
LAIRD TECHNOLOGIES
热缝隙填充, 229 X 229MM, 1MM
(EN)LAIRD TECHNOLOGIES
热绝缘, 导热界面, 12" x 18", 玻璃纤维 / 硅橡胶, 6 kV, 0.23 mm, 1000000 Mohm-m, 1.17 °C/W
(EN)
LAIRD TECHNOLOGIES
热缝隙填充, 229 X 229MM, 2MM
(EN)LAIRD TECHNOLOGIES
热缝隙填充, 229 X 229MM, 2MM
(EN)
LAIRD TECHNOLOGIES
热缝隙填充, 229 X 229MM, 1MM
(EN)LAIRD TECHNOLOGIES
热缝隙填充, 229 X 229MM, 4MM
(EN)
