PANASONIC ELECTRONIC COMPONENTS

射频模块, 收发器, 蓝牙, CC2560A, 2.4GHZ

MICROCHIP

RN 42 Series Class 2 Bluetooth module with PCB Antenna

LS RESEARCH

模块, TIWI-BLE, WLAN, 2.4GHZ, UFL连接器

LAIRD TECHNOLOGIES

蓝牙模块, BISM II, 陶瓷天线

PANASONIC ELECTRONIC COMPONENTS

射频模块, 收发器, 蓝牙, CC2564, 2.4GHZ

LS RESEARCH

模块, TIWI-SL CC3000, WLAN, 2.4GHZ

PANASONIC ELECTRONIC COMPONENTS

射频模块, 收发器, 蓝牙, TC35661, 2.4GHZ

LS RESEARCH

模块, TIWI5, WLAN + BT 2.1 EDR

LS RESEARCH

电路板, PROFLEX01 ARDUINO子板, 带天线

LS RESEARCH

电路板, SIFLEX02 ARDUINO子板, 天线

LS RESEARCH

模块, PROFLEX01-R2, ZIGBEE, 2.4GHZ, UFL

LS RESEARCH

模块, ZB MODFLEX MGE, PROFLEX01-R2

LS RESEARCH

模块, ZB MODFLEX MGU, PROFLEX01-R2

PANASONIC ELECTRONIC COMPONENTS

射频模块, 收发器, 蓝牙, CC2560A, 2.4GHZ

PANASONIC ELECTRONIC COMPONENTS

射频模块, 收发器, 蓝牙, CC2541, 2.4GHZ

MICROCHIP

适配器, 无驱动USB蓝牙适配器

MICROCHIP

RN 42 Series Class 2 Bluetooth module with U.FL Antenna

TE CONNECTIVITY

铁氧体磁芯, 300mA, 0805

PANASONIC ELECTRONIC COMPONENTS

SMD片式电阻, 厚膜, 3.6 kohm, 150 V, 0805 [2012公制], 125 mW, ± 5%, ERJ6E 系列

PANASONIC ELECTRONIC COMPONENTS

SMD片式电阻, 厚膜, 12 kohm, 50 V, 0402 [1005公制], 100 mW, ± 5%, ERJ2G 系列

PANASONIC ELECTRONIC COMPONENTS

SMD片式电阻, 厚膜, 36 ohm, 50 V, 0402 [1005公制], 100 mW, ± 5%, ERJ2G 系列

PANASONIC ELECTRONIC COMPONENTS

SMD片式电阻, 厚膜, 6.8 ohm, 50 V, 0402 [1005公制], 100 mW, ± 5%, ERJ2G 系列

PANASONIC ELECTRONIC COMPONENTS

SMD片式电阻, 厚膜, 4.3 kohm, 150 V, 0805 [2012公制], 125 mW, ± 5%, ERJ6GE 系列

PANASONIC ELECTRONIC COMPONENTS

SMD片式电阻, 厚膜, 30 ohm, 50 V, 0402 [1005公制], 100 mW, ± 5%, ERJ2G 系列

PANASONIC ELECTRONIC COMPONENTS

SMD片式电阻, 厚膜, 3 ohm, 150 V, 0805 [2012公制], 125 mW, ± 5%, ERJ6GE 系列