BERGQUIST
软导热材料 HI-FLOW 625
热绝缘, Q-Pad 3, .005", 12" x 12"片, 聚合物弹性体, 石墨填充, 2 W/m.K, 0.127 mm, 10 ohm-m, 0.65 °C/W
热绝缘, Q-Pad 3, .005", 12" x 12"片, 聚合物弹性体, 石墨填充, 2 W/m.K, 0.127 mm, 100 ohm-m
热绝缘, Bond-Ply 100, .005", 6" x 6"板, 碳, 0.8 W/m.K, 3000 V, 0.127 mm, 100000000000 ohm-m