规格：电介质强度 -,
T GLOBAL
高导热石墨垫, 0.16MM
(EN)
BERGQUIST
热绝缘, Bond-Ply 100 .008", 12" x 12"板, 0.8 W/m.K, 6 kV, 0.203 mm
(EN)
PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 91 mm
(EN)
BERGQUIST
热绝缘, Q-Pad 3, .005", 12" x 12"片, 聚合物弹性体, 石墨填充, 2 W/m.K, 0.127 mm, 100 ohm-m
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 51 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 120 mm
(EN)
T GLOBAL
空隙填充导热垫, 2MM 片状
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 38 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 105.5 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 89.5 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 106 mm
(EN)
BERGQUIST
热绝缘, Sil-垫 1500ST .008", 4" x 4"片, 1.8 W/m.K, 3 kV, 0.203 mm, 100000 Mohm-m
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 124 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 127.5 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 126 mm
(EN)PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 138 mm
(EN)
