LAIRD TECHNOLOGIES
热绝缘, 导热界面, 11" x 18", PI 聚酰亚胺薄膜, 6 kV, 0.076 mm, 100000000 Mohm-m
PANASONIC ELECTRONIC COMPONENTS
热接口材质, 软PGS, 400 W/m.K, 石墨片, 200 μm, 158 mm
BERGQUIST
热绝缘, 缝隙垫, 5000S35 .100" 4" x 4" 片, 5 W/m.K, 2.54 mm, 1000 Mohm-m
AMEC THERMASOL
热绝缘, 填充垫, 3W/MK, 20支撑 00, 0.8mm, 硅橡胶, 3.15 W/m.K, 0.8 mm