T GLOBAL
热绝缘, 缝隙填充, 面板, 碳, 1.7 W/m.K, 2 mm
LAIRD TECHNOLOGIES
热绝缘, Thermaflex管, TO-3P, 硅树脂喷出, 0.7 W/m.K, 8000 V, 0.5 mm
BERGQUIST
热绝缘, Sil-垫 400, .007", 12" x 12"片, 玻璃纤维 / 硅橡胶, 0.9 W/m.K, 4.5 kV, 177.8 μm, 10 ohm-m, 1.82 °C/W
BERGQUIST
热绝缘, 散热垫, TO-3P, PI 聚酰亚胺薄膜, 1.3 W/m.K, 6 kV, 0.152 mm, 10 ohm-m, 0.86 °C/W
FISCHER ELEKTRONIK
热绝缘, 导热铝箔, 粘合剂, 尼龙(聚酰胺), (PI聚酰亚胺薄膜), 0.37 W/m.K, 0.127 mm
FISCHER ELEKTRONIK
热绝缘, 导热铝箔, 粘合剂, 尼龙(聚酰胺), (PI聚酰亚胺薄膜), 0.37 W/m.K, 0.127 mm
BERGQUIST
热绝缘, 高流动, 300P .001", 4" x 4" 片, 1.6 W/m.K, 5 kV, 0.025 mm, 1000000 Mohm-m
BERGQUIST
热绝缘, Sil-垫 K-10, .006", 12" x 12"片, PI 聚酰亚胺薄膜, 1.3 W/m.K, 6 kV, 0.152 mm, 10 ohm-m, 0.86 °C/W
BERGQUIST
热绝缘, 高流动, 225F-AC .004", 4" x 4" 片, 1 W/m.K, 0.102 mm
T GLOBAL
热绝缘, 缝隙填充, 面板, 4 W/m.K, 0.5 mm
AAVID THERMALLOY
导热绝缘垫片, TO-3
NTE ELECTRONICS
热绝缘片, THERMO PAD系列, TO-3PML
FISCHER ELEKTRONIK
热绝缘, 导热铝箔, 粘合剂, 尼龙(聚酰胺), (PI聚酰亚胺薄膜), 0.37 W/m.K, 0.127 mm
T GLOBAL
热绝缘, 缝隙填充, 面板, 碳, 1.6 W/m.K, 0.5 mm
MULTICOMP
热绝缘, 绝缘套件, Mica, 云母, 1 kV, 0.1 mm
LAIRD TECHNOLOGIES
热绝缘, 散热垫, TGARD 500-A0 12" x 18", 碳, 6 kV, 2.9 °C/W
NTE ELECTRONICS
绝缘片套件, 用于TO-220 (塑料TO-66)
MULTICOMP
绝缘套件
BERGQUIST
热绝缘, .040", 4" x 4"板, 缝隙垫 2500 S80, 2.7 W/m.K, 6 kV, 1.016 mm, 100000 Mohm-m, 0.74 °C/W
T GLOBAL
热绝缘, 缝隙填充, 面板, 3.2 W/m.K, 2 mm
FISCHER ELEKTRONIK
热绝缘, 导热铝箔, 粘合剂, 尼龙(聚酰胺), (PI聚酰亚胺薄膜), 0.37 W/m.K, 0.127 mm
T GLOBAL
热绝缘, 缝隙填充, 面板, 4.8 W/m.K, 0.5 mm
FISCHER ELEKTRONIK
热绝缘, 导热铝箔, 粘合剂, 尼龙(聚酰胺), (PI聚酰亚胺薄膜), 0.37 W/m.K, 0.127 mm