The device consists of a linear Hall sensor circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which is sensed by the integrated Hall IC and converted into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic signal to the Hall transducer.
No external sense resistor required; single package solution
1.2 mR internal conductor resistance; reduced power loss
Economical low- and high-side current sensing
Output voltage proportional to AC or DC currents
Low-noise analogue signal path
Integrated electrostatic shield for output stability
(EN)
