The 531002B02500G is a 25.4 x 12.7 x 34.92mm extruded Heat Sink with radial fins and notched base and solderable pins. This board level heat sink is made of aluminium with black anodized finish and features vertical mount orientation. This heat sink is suitable for use with TO-220, TO-220-single gauge devices. This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
