MULTICOMP
芯片插座, DIP, 触点数:40, 排距:0.3''
芯片插座, DIP, 触点数:40, 排距:0.3'', 1A
MILL MAX
芯片插座, DIP, 40路
AMP - TE CONNECTIVITY
插座, DIP, 40路, 通孔
AMPHENOL FCI
芯片和元件插座, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
芯片和元件插座, ICD Series, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
KESTER SOLDER
焊丝, 63/37 锡/铅, 183 度, 1磅
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