产品分类：芯片插座,规格：排距 15.24mm,
AMPHENOL FCI
插座, DIP-28, 通孔安装
(EN)
MULTICOMP
芯片和元件插座, 2227系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
3M
插座, DIP, 28路, 通孔安装
(EN)
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀金触芯
AMPHENOL FCI
芯片和元件插座, DIP插座, 32 触点, 2.54 mm, 15.24 mm, 镀锡触芯
AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP插座, 28 触点, 2.54 mm, 15.24 mm, 镀金触芯
AMPHENOL FCI
芯片插座, DIP, 32路, 通孔安装
(EN)
MULTICOMP
芯片和元件插座, 2227MC系列, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
MULTICOMP
芯片插座, DIP, 触点数:40, 排距:0.3''
(EN)
3M
插座, DIP, 28路, 通孔
(EN)AMP - TE CONNECTIVITY
芯片和元件插座, 800系列, DIP, 24 触点, 2.54 mm, 15.24 mm, 镀金触芯
3M
芯片插座, DIP40, 宽0.6英寸
(EN)MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 32 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 24 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
3M
芯片插座, DIP-24
(EN)
MILL MAX
芯片插座, DIP, 28路, 通孔安装
(EN)
TE CONNECTIVITY
芯片和元件插座, DIP插座, 28 触点, 2.54 mm, 15.24 mm, 镀锡触芯
MILL MAX
芯片插座, DIP, 32路, 通孔安装
(EN)
MULTICOMP
芯片插座, DIP, 触点数:24, 排距:0.3''
(EN)
HARWIN
芯片和元件插座, D28系列, DIP, 32 触点, 2.54 mm, 15.24 mm, 镀金触芯
(EN)
TE CONNECTIVITY
芯片和元件插座, DIP插座, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
AMP - TE CONNECTIVITY
芯片插座, DIP, 触点数:28, 排距:0.6''
(EN)MILL MAX
芯片插座, DIP, 40路
(EN)MULTICOMP
芯片和元件插座, 2227MC系列, DIP, 40 触点, 2.54 mm, 15.24 mm, 镀锡触芯
(EN)
TE CONNECTIVITY
芯片插座, DIP, 触点数:28, 排距:0.6''
(EN)
